NXP Semiconductors TDA8932B Uživatelský manuál stáhnout pdf (Strana 45)

Product data sheet Rev. 03— 21 June 2007 45 of 48

NXP Semiconductors

TDA8932B

Class-D audio ampliﬁer

For further information on temperature proﬁles, refer to Application Note

AN10365

“Surface mount reﬂow soldering description”

18. Abbreviations

MSL: Moisture Sensitivity Level

Fig 42. Temperature proﬁles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 18. Abbreviations

Acronym Description

BTL Bridge Tied Load

DMOS Double diffused Metal Oxide Semiconductor

ESD ElectroStatic Discharge

OCP OverCurrent Protection

OTP OverTemperature Protection

OVP OverVoltage Protection

PWM Pulse Width Modulation

SE Single-Ended

TF Thermal Foldback

UBP UnBalance Protection

UVP UnderVoltage Protection

WP Window Protection

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NXP Semiconductors TDA8932B Uživatelský manuál Strana 45