NXP Semiconductors TDA8932B Uživatelský manuál stáhnout pdf (Strana 16)

Product data sheet Rev. 03— 21 June 2007 16 of 48

NXP Semiconductors

TDA8932B

Class-D audio ampliﬁer

10. Limiting values

[1] V

= V

DDP1

− V

SSP1

= V

DDP2

− V

SSP2

[2] Measured with respect to pin INREF; V

< V

+ 0.3 V.

[3] Measured with respect to pin V

SSD(HW)

; V

< V

+ 0.3 V.

[4] Measured with respect to pin CGND; V

< V

+ 0.3 V.

[5] V

= V

SSP1

= V

SSP2

; V

= V

DDP1

= V

DDP2

[6] Current limiting concept.

[7] Human Body Model (HBM); R

= 1500 Ω; C = 100 pF

For pins 2, 3, 11, 14 and 15 V

esd

= ±1800 V.

[8] Machine Model (MM); R

=0Ω; C = 200 pF; L = 0.75 µH.

11. Thermal characteristics

Table 8. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

supply voltage asymmetrical supply

[1]

−0.3 +40 V

voltage on pin x

IN1P, IN1N, IN2P, IN2N

[2]

−5+5V

OSCREF, OSCIO, TEST

[3]

SSD(HW)

− 0.3 5 V

POWERUP, ENGAGE,

DIAG

[4]

CGND

− 0.3 6 V

all other pins

[5]

− 0.3 V

+ 0.3 V

ORM

repetitive peak output

current

maximum output

current limiting

[6]

4-A

junction temperature - 150 °C

stg

storage temperature −55 +150 °C

amb

ambient temperature −40 +85 °C

P power dissipation - 5 W

esd

electrostatic discharge

voltage

HBM

[7]

−2000 +2000 V

[8]

−200 +200 V

Table 9. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

SO32 package

th(j-a)

thermal resistance from junction

to ambient

free air natural convection

JEDEC test board

[1]

- 41 44 K/W

2 layer application board

[2]

- 44 - K/W

j-lead

thermal characterization

parameter from junction to lead

- - 30 K/W

j-top

thermal characterization

parameter from junction to top

[3]

- - 8 K/W

1 2 ... 11 12 13 14 15 16 17 18 19 20 21 ... 47 48

TDA8932B 1

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